The Universal-300 B is a 12-inch CMP device based on innovative technology developed by Hwatsing with independent intellectual property rights. The device is equipped with superior performance polishing units, compatible with 4/6/8/12 inch wafers, suitable for a variety of materials, can achieve ultra-high wafer surface flatness, it has a small footprint, high cost performance advantages, can meet the needs of mature process technology, widely used in silicon wafer, third generation semiconductor, MEMS and other manufacturing processes.
Multi-section polishing head
Compatible with 4/6/8/12 inch wafers
Dry in and wet out of products
Small floor space, high cost performance
Satisfy mature process technology requirements
Used for CMP processes such as Oxide/SiN/STI/Poly/Cu/W