2013
2014
2015
2017
2019
2021
2022
2013.04.10Hwatsing established
2014.03The first domestic 12 inches CMP business models developed by Universal - 300
2015.11Hwatsing undertaked important projects
2017The Universal-300 Plus entered the client, and since then, models such as Universal-300 Dual, Universal-300 X, and Universal-300 T have successively entered the market, forming batch sales. The market share and import substitution rate of the company's CMP equipment are among the top domestic IC equipment.
2019.09Hwatsing CMP equipment produces more than 1 million wafers on the client's large production line
2021.06Hwatsing's 100th 12-inch CMP equipment shipped
2021.07The grinding and polishing equipment industrial base was launched
2021.09First 12-inch ultra-precision wafer thinning machine entered the client verification
2021.11Awarded the national "single champion demonstration enterprise in manufacturing industry"
2021.12In 2021, more than 100 machines had been manufactured
2022.01Hwatsing CMP equipment entered the international head packaging customer
2022.02Hwatsing wafer reclaim products were produced in large scale, with the cumulative shipment exceeding 100000 pieces
2022.06.08Hwatsing successfully landed on the Kechuang board of Shanghai Stock Exchange, with the stock code of 688120
