The Universal-300 E is a mature 12-inch CMP device developed for the mid-to-high end market. The equipment has innovative technology with independent intellectual property rights, equipped with superior performance polishing and cleaning units, integrated with a variety of advanced endpoint detection technology. The device has excellent process stability and high production efficiency, can achieve ultra-high wafer surface flatness, meet the needs of mature process technology, and is widely used in integrated circuits, advanced packaging, large silicon wafer and other manufacturing processes.
Multi-section polishing head
Excellent process stability and high productivity
Dry-in and dry-out
Satisfy mature process technology requirements
Used for CMP processes such as Oxide/SiN/STI/Poly/Cu/W