Versatile-GP300 is an advanced 12-inch ultra-precision wafer grinding equipment developed according to the current high-end market demand of 3D IC manufacturing, advanced packaging and so on. The equipment integrates advanced ultra-precision grinding, CMP and post-cleaning technology through the innovative layout of the new complete machine, and is equipped with excellent thickness deviation and surface defect control technology. It can provide a variety of system function expansion options, with the advantages of high precision, high rigidity, and flexible process development. Versatile-GP300 can flexibly expand and develop a variety of configurations, which greatly meets the needs of ultra-precision wafer thinning technology in 3D IC manufacturing, advanced packaging and other fields.
Integrate advanced ultra-precision grinding, CMP and post-cleaning process
Excellent thickness deviation and surface defect control technology
High precision, high rigidity and flexible process development
Flexible expansion and development of multiple configurations