The Universal-300 Dual is a mature 12-inch CMP device developed based on the innovative technology of Hwatsing's independent intellectual property rights. The equipment is equipped with multiple sets of polishing units and cleaning units with superior performance, integrates a variety of advanced end-point detection technologies, and has excellent process adjustability and stability. It can achieve ultra-high flatness of the wafer surface, meet the needs of mature manufacturing technology, and is widely used in integrated circuits, advanced packaging, large silicon wafers and other manufacturing processes.
Multi-section polishing head
Excellent process adjustability and stability
Dry-in and dry-out
Satisfy mature process technology requirements
Used for CMP processes such as Oxide/SiN/STI/Poly/Cu/W