Universal-200 Smart is a mature 8-inch CMP device developed according to the current market demand. The equipment has innovative technology with independent intellectual property rights, equipped with polishing and cleaning units with superior performance, integrated with a variety of advanced endpoint detection technologies, high output, stable performance, flexible process combination, can achieve ultra-high flatness of wafer surface, meet the needs of mature manufacturing technology, and is widely used in integrated circuits, advanced packaging, silicon wafers, third-generation semiconductors, MEMS, Micro LED and other manufacturing processes.
Multi-section polishing head
Integrate multiple advanced endpoint detection technologies
Dry-in and dry-out
Satisfy mature process technology requirements
Used for CMP processes such as Oxide/STI/Poly/Cu/W