The Universal-300 X is an advanced 12-inch CMP device developed for the current high-end market. The equipment uses Hwatsing's innovative technology with independent intellectual property rights, is equipped with superior performance polishing and cleaning units, and integrates a variety of advanced endpoint detection technologies. The equipment is efficient and stable, and the process combination is flexible, which can realize the global flattening of the wafer at the nanometer level, meet the needs of advanced manufacturing technology, and is widely used in integrated circuits, advanced packaging, large silicon wafer and other manufacturing processes.
Ultra-precision multi-zone polishing head
Integrate multiple advanced endpoint detection technologies
Dry-in and dry-out
Satisfy the needs of advanced manufacturing technology
Used for CMP processes such as Oxide/SiN/STI/Poly/Cu/W