The Universal-300 T is a leading 12-inch CMP equipment developed based on the advanced CMP equipment of Hwatsing and according to the industry's cutting-edge technology requirements. The equipment is based on the innovative technology of the independent intellectual property rights of Hwatsing, equipped with polishing units with superior performance, integrated with a variety of endpoint detection technologies, and equipped with more advanced combined cleaning technology, showing a better cleaning effect. This equipment can realize the global flattening of wafer at nanometer level, meet the requirements of advanced manufacturing technology, and is widely used in manufacturing processes such as integrated circuits, advanced packaging, large silicon chips, etc.
Ultra-precision multi-zone polishing head
Integrate multiple advanced endpoint detection technologies
Equipped with advanced cleaning technology
Satisfy the needs of advanced manufacturing technology
Used for CMP processes such as Oxide/SiN/STI/Poly/Cu/W